Soldering Flux Syringe 10g (NC-559)

NC-559-ASM is a high-activity, no‑clean soldering flux paste formulated to promote fast wetting, excellent solderability and strong solder joints for both production and repair work. Designed for hand soldering, rework and touch-up applications, this flux delivers consistent performance on common PCB finishes (HASL, ENIG, OSP) and components. Its no‑clean formulation leaves minimal non‑conductive residues, reducing the need for post‑solder cleaning in many applications — though cleaning is recommended for sensitive electronics and high-reliability assemblies.

Key features

• High-activity flux chemistry for rapid wetting and improved solder flow
• No‑clean formulation: low, non‑conductive residues under normal conditions
• Ideal for hand soldering, SMD rework, BGA/IC reflow touch‑ups and through‑hole repair
• Compatible with common solder alloys (Sn-Pb, SAC305, SACX)
• Smooth, paste-like consistency — easy to apply with syringe or brush
• Enhances joint reliability and reduces solder bridges and cold joints
• Temperature stable for typical soldering profiles
• Available in multiple syringe sizes (e.g., 10 g, 25 g) depending on vendor

Typical specifications

• Product type: No‑clean rosin-based solder flux paste
• Activity level: High (for difficult to wet surfaces and oxidized pads)
• Appearance: Amber/yellow paste (may vary slightly by batch)
• Viscosity/consistency: Syringe-ready paste
• Compatibility: Works with Sn-Pb and lead-free alloys (e.g., SAC305)
• Shelf life: Typically 12–24 months when stored sealed at recommended conditions (check manufacturer label)
• Storage: Store in cool, dry place away from direct sunlight; avoid freezing

What’s included

• 1 × NC-559-ASM flux paste syringe (size as selected)
• 1 x dispensing tip (depending on product variant) — check product variant details
• Optional: Dispencing handle (SKU 3421)

Usage & application notes

Apply small amount to pads or component leads using the syringe tip, fine brush or applicator. Solder immediately after flux application for best results; if left exposed, active compounds may diminish. For rework, apply flux to component pads and leads, then heat with soldering iron or hot-air rework station following recommended temperature profiles. Excessive application can increase residue — use sparingly for cleaner results.

Safety & handling

• Contains active chemicals and rosin derivatives. Avoid skin and eye contact.
• Use in well‑ventilated area. Avoid inhalation of fumes during soldering — use fume extraction when possible.
• Wear protective gloves and safety glasses when handling. Wash hands after use.
• Keep out of reach of children. Not for consumer consumption.
• Refer to the product Safety Data Sheet (SDS) for full hazard, first‑aid, handling and disposal information.

Compatibility & cleaning

• Suitable for PCBs finished with HASL, ENIG, OSP and other common surface finishes.
• No‑clean residues are typically non‑conductive and acceptable for many applications; however, for high‑reliability or conformal-coated electronics, clean residues with an appropriate flux remover (IPA, specialized flux cleaner) following manufacturer recommendations.
• Confirm compatibility with sensitive components and plated finishes in critical applications.

Common use cases

• Electronics assembly bench work and production touch‑ups
• SMD rework and BGA/IC re-soldering
• Through‑hole component repair and lead forming
• Hobbyist and maker projects requiring reliable joints