Soldering Flux Syringe 10g (NC-559)
Delivery: 2-5 working days
SMANZON NC-559 Soldering Flux, No-Clean Flux Paste Syringe (10g/PCS)
NOTE: Optional - Dispencing handle (SKU 3421)
NC-559-ASM is a high-activity, no‑clean soldering flux paste formulated to promote fast wetting, excellent solderability and strong solder joints for both production and repair work. Designed for hand soldering, rework and touch-up applications, this flux delivers consistent performance on common PCB finishes (HASL, ENIG, OSP) and components. Its no‑clean formulation leaves minimal non‑conductive residues, reducing the need for post‑solder cleaning in many applications — though cleaning is recommended for sensitive electronics and high-reliability assemblies.
Key features
- High-activity flux chemistry for rapid wetting and improved solder flow
- No‑clean formulation: low, non‑conductive residues under normal conditions
- Ideal for hand soldering, SMD rework, BGA/IC reflow touch‑ups and through‑hole repair
- Compatible with common solder alloys (Sn-Pb, SAC305, SACX)
- Smooth, paste-like consistency — easy to apply with syringe or brush
- Enhances joint reliability and reduces solder bridges and cold joints
- Temperature stable for typical soldering profiles
- Available in multiple syringe sizes (e.g., 10 g, 25 g) depending on vendor
Typical specifications
- Product type: No‑clean rosin-based solder flux paste
- Activity level: High (for difficult to wet surfaces and oxidized pads)
- Appearance: Amber/yellow paste (may vary slightly by batch)
- Viscosity/consistency: Syringe-ready paste
- Compatibility: Works with Sn-Pb and lead-free alloys (e.g., SAC305)
- Shelf life: Typically 12–24 months when stored sealed at recommended conditions (check manufacturer label)
- Storage: Store in cool, dry place away from direct sunlight; avoid freezing
What’s included
- 1 × NC-559-ASM flux paste syringe (size as selected)
- 1 x dispensing tip (depending on product variant) — check product variant details
- Optional: Dispencing handle (SKU 3421)
Usage & application notes
Apply small amount to pads or component leads using the syringe tip, fine brush or applicator. Solder immediately after flux application for best results; if left exposed, active compounds may diminish. For rework, apply flux to component pads and leads, then heat with soldering iron or hot-air rework station following recommended temperature profiles. Excessive application can increase residue — use sparingly for cleaner results.
Safety & handling
- Contains active chemicals and rosin derivatives. Avoid skin and eye contact.
- Use in well‑ventilated area. Avoid inhalation of fumes during soldering — use fume extraction when possible.
- Wear protective gloves and safety glasses when handling. Wash hands after use.
- Keep out of reach of children. Not for consumer consumption.
- Refer to the product Safety Data Sheet (SDS) for full hazard, first‑aid, handling and disposal information.
Compatibility & cleaning
- Suitable for PCBs finished with HASL, ENIG, OSP and other common surface finishes.
- No‑clean residues are typically non‑conductive and acceptable for many applications; however, for high‑reliability or conformal-coated electronics, clean residues with an appropriate flux remover (IPA, specialized flux cleaner) following manufacturer recommendations.
- Confirm compatibility with sensitive components and plated finishes in critical applications.
Common use cases
- Electronics assembly bench work and production touch‑ups
- SMD rework and BGA/IC re-soldering
- Through‑hole component repair and lead forming
- Hobbyist and maker projects requiring reliable joints
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